Bienvenidos a nuestro nuevo Blog Comunidad Instron organizado por Instron. Es una recopilación de las más actuales, brillantes, y talentosas mentes que Instron tiene para ofrecer. El mundo de la ciencia de los materiales es tan vasto y abarca la más amplia gama de industrias, materiales, y los desafíos que ninguna persona posiblemente puede poseer todo el conocimiento necesario para ser un experto o para dominar la ciencia de los materiales. Se necesita un pequeño ejército que colaboren y comparten conocimientos técnicos, experiencias e ideas para presentar la información más precisa, relevante y actualizada a todos ustedes nuestros lectores.
Le invitamos a que nos digas quiénes, comparta sus historias y nos hable de sus experiencias. Únase a la Comunidad Instron.
As a standard feature with the new Bluehill® Universal Software, QuickTest allows operators to start testing after merely entering basic parameters in a few seconds.
Jun 08, 2017 01:26 PM
As anyone with a smartphone is aware, software developers are constantly improving their software with periodic updates for a variety of reasons. Major phone companies release updates at least once a year, and in between the major updates, they push out smaller bug fixes and patches as flaws are inevitably found in the program, application, or operating system. This same idea applies with Bluehill® Software.
May 24, 2017 10:32 AM
The progressive outcome of Bluehill® Universal took a consolidated effort from Instron experts, bringing together unrivaled experience and cutting-edge research. The user experience has been designed by a collaboration of members from different software teams across the world, each team representing various software products offered by Instron. This consortium has worked closely together to create a Bluehill application style that can be translated across all of Instron’s software products.
Apr 13, 2017 04:18 PM
Reliability analysis of electronic packages and components is a critical step in microelectronics, as these packages are widely used in portable devices such as smartphones, tablets, laptops, etc. Studying electrical performance may not be enough, as a package’s mechanical characterization can directly or indirectly impact reliability of a finished product. Three-point bend tests are performed to understand the strength of chip packages, such as chip-on-film (COF), integrated circuits (IC), and ball grid arrays (BGAs).
Apr 03, 2017 03:33 PM
Accurate and repeatable test results are the most important product of a mechanical test. Properly managing these test results can be more challenging than conducting the test itself. Although there are several common data management and results reporting practices throughout the testing industry, most labs take approaches that are unique to them. In order to make it easier for all labs to take control of their test results and data, we have introduced several new exporting features with the release of Bluehill® Universal.
Mar 30, 2017 01:36 PM
There are many different reasons why you should calibrate your testing system. Primarily, calibration is performed to ensure that your testing system is operating within its requirements. Whether these requirements are established by law, government regulation, industry regulation, or your own company quality system, organizations have recognized the importance of calibrating systems at regular intervals.
Mar 23, 2017 09:04 AM
Let’s begin with a definition from The International Vocabulary of Metrology (VIM): Metrological Traceability is the property of a measurement result whereby the result can be related to a reference through a documented unbroken chain of calibrations, each contributing to the measurement uncertainty.
Feb 12, 2017 04:14 PM
Instron Spain participates, from September 27th 2016 to March 27th 2017, to the first Virtual Fair of Adhesive Solutions, organized by the company 3M.
As part of the set of conferences that took place under the Virtual Showroom of Adhesion Solutions, Instron has hold a webinar on Testing Solutions for Adhesives Mechanical Characterization. Ivan Garcia, Instron Spain manager, explains standards and tensile, shear, impact and dynamic testing solutions focus on adhesives bonded surfaces .
Dec 21, 2016 11:34 AM
Instron Applications Engineers Maeve Higham and Alessandro Zazzarelli sat down for an interview to share their great work for Europe’s Young Professionals Network. This newly established cohort is gathering across Europe and supporting the rising talent of Illinois Tool Works (ITW), Instron’s parent company.
Dec 08, 2016 10:14 AM
Instron Biomedical Market Manager Elayne Gordonov recently reviewed the state of biomaterials testing and characterization with Advanced Materials & Processes (AM&P) Magazine.
Dec 04, 2016 02:13 PM